Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Number of Employees:
75
Year of Establishment:
2010-01-08
Management System Certification:
ISO9001:2015
Average Lead Time:
Peak season lead time: 1-3 months
Off season lead time: one month
OEM/ODM Service

Milling Machine, Embedding Machine, Milling and Embedding Machine manufacturer / supplier in China, offering Card Making Machine (YMJ-TOT10-3000), Embedding Machine (YMJ-NO10-5000) for IC Card, Full Auto RFID Code Printing Machine for Clothing Label and so on.

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Card Making Machine (YMJ-TOT10-3000)

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Min. Order: 1 Piece
Production Capacity: About 2500 PCS/Hr
Transport Package: Wooden Case
Payment Terms: T/T
Type: Smart Card Milling and Embedding Machine
Object: Equipment
Structure: Desktop
Controlling Mode: Program Control
Automatic Grade: Automatic
Precision: High Precision

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Basic Info

Model NO.: YMJ-TOT10-3000
Overall Dimension: Approx. L2200*W1200*H1800mm
Weight: Approx. 1500kg
Power Supply: AC220V 50/60Hz 20A
Power: Approx.3.5kw
Air Pressure: 6 Kg /Cm2
Air Consumption: About 110L/Min
Control: Dual Axis + PLC
Accuracy: Scale of Servo System = 0.01mm
Operator: 1 Person
Output Rate: About 2500 PCS/Hr
Trademark: YMJ
Specification: CE
Origin: Shenzhen, China
Feature:
This machine is used to mill the slot on standard card which use to embed different kinds of modules. And at the same time, test, glue and punch different modules and implant them into milled cavities for IC embedding. Only need one operator, stable and easy to adjust.
In the machine structure, the machine is easy to operate and maintain, which enhances the service life of machine and the productivity.
The appearance and style of the machine is concise and easy, rationalization and hommization, and the user-friendly operator interface protect the safety of operators. We can also design the different style appearance according to different requirements.
We offer the perfect after-sale service and technical follow-up, and provide paid lifelong maintenance.
Main function:
1. Integration of cavities milling, vacuum cleaning, depth detection, spot welding, module punching, embedding and testing.
2. Specialized fixture design to ensure the accuracy of milling depth without any influences from card thickness and size.
3. Pre-set with four standard module milling programs which may be called according to actual requirements, with parameters to be modified at ease.
4. Two groups of X, Y, Z axis, it can be choose the first layer and second layer milling separately, which has improved manufacturing efficiency and get rid of the difficulty of modifying the center position while milling.
5. The milling depth of the Z-Axis is realized through guide rail and the screw driven by high precision servomotor to provide accurate milling depth, eliminating complicated process of tool changing.
6. Testing the slot position before embedding, it embeds when the card have been milled while don not embeds if the card haven't been milled.
7. Module Tape stepping is monitored by accurate sensor to identify good and faulty modules automatically.
8. Unique plane structure and several heating heads for hot pressing, solving the problem that hot melt adhesive is hard to apply. No plane adjustment is required to change hot pressing head.
9. Modules are conveyed by the servo drive high-precision guide rail and screw, with position to be changed through direct modification of parameters.
10. Unique plane structure of hot pressing head ensures no delaminating, and the hot welding head with X and Y directions fine-tuning function. When changing a soldering head, no needs to adjust the plane again. Groups of hot pressing head ensure quality of the embedding.
11. Cards are conveyed by the belt, ensuring safety and stability.
12. Tailored software design makes the operation easy and simple.
13. Module ATR detection device ensures acceptable embedding rate.
14. Unique card feeding design avoids feeding of double cards which would happen due to static electricity.
15. Identify good and faulty modules automatically, reject and collect the faulty modules automatically.
16. Testing the basal card before hot welding, It won't be welded without chip.
17. With the double card testing function.

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